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                UL /IEC/ EN 60950 Test Probe Kits BND-TPK01

                Product Description:UL /IEC/ EN 60950 IEC61032 Test Probe KitsModel:BND-TPK01Product Details:The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)· 50mm Impact Test Ball (BND-G500R)
                Description

                Product Description:

                UL /IEC/ EN 60950 IEC61032 Test Probe Kits

                Model:BND-TPK01


                Product Details:

                The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

                · IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

                · 50mm Impact Test Ball (BND-G500R)

                · Test Pin Probe: short (BND-13)

                · Rigid Finger Probe (BND-11)

                · Ball Pressure Tester (BND-QY102)

                · Telecom Test Probe (BND-TB12)

                Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950


                Datasheets of BND-TPK01 test probe kit:


                test probe B 1.jpgIEC61032  IEC60950  IEC60335
                IEC60529  IEC60045  IEC60884
                IEC60745
                Knurled Finger Diameter:12mm
                Knurled Finger Length:80mm
                Baffle Plate Diameter:50mm
                Baffle Plate Length:100mm
                Baffle Thickness:20mm
                BND-G500R
                Test Sphere 500G with ring
                 2.jpgIEC61032  IEC60529Diameter:50mm
                Weight:227g
                BND-13
                Short Test Pin
                 3.jpgIEC60065
                IEC60335
                IEC61032
                The probe Diameter:Head 3mm Tail 4mm
                The probe Length:15mm
                Dam-board Diameter:25mm
                Dam-board Thickness:4mm
                BND-11
                Rigid Test Probe 11
                 4.jpgIEC61032
                IEC60065
                IEC60335
                IEC60884
                Nodular Finger Length:80mm
                Nodular Finger Diameter:12mm
                Dam-board Diameter:50mm
                Dan-board Thickness:5mm
                BND-TB12
                12mm Telecom Test Probe
                 5.jpgIEC60065 IEC60695 IEC60950Probe Diameter:12mm
                Probe Length:80mm
                Baffle Plate Diameter:50mm
                BND-QY102
                Ball Pressure Apparatus
                 6.jpgIEC60695-10-2 IEC60884
                IEC60320 IEC60335
                IEC60598
                IEC60950
                Ball diameter:5MM
                Total test pressure:20N±0.2N
                Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder



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